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Background

Dae Young Jung received B.S. and M.S. degrees in metallurgical engineering from Seoul National University, Korea, and his doctorate in physical metallurgy from the University of Illinois, Champaign-Urbana, Illinois. Jung joined ºÚÁÏÊÓƵ in 2007. He has extensive experience in the design and manufacturing process for printed circuit boards, semiconductor packaging, CMOS BEOL integration, electronic interconnect materials, reliability evaluation of electronic products, chip-package-interaction (CPI) evaluation, materials characterization and analysis using electron optical instruments. He is also a visiting professor in the Watson School of Engineering and Applied Science at Binghamton. Since 2009, he has been collaborating with Advanced Semiconductor Engineering Corp. Jung was a research staff member at a nuclear fuel fabrication development laboratory of Korea Atomic Energy Research Institute until 1976. He was an R&D scientist for semiconductor and packaging technology development at IBM for 25 years until his retirement in 2007.