A Message from the 2025 EPS Organizing Committee:
Our 36th annual Electronics Packaging Symposium took place on Sept. 3-4, 2025, at the GE Aerospace Research Center in Niskyuna NY. We focused on various aspects of electronic packaging and how advance packaging is evolving toward a Chiplet future. We look forward to seeing you there.
EXECUTIVE CHAIRS:
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Dr. Mukesh V. Khare Vice President, Semiconductor and AI Hardware IBM Research |
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Dr. Bahgat Sammakia Vice President for Research 黑料视频 |
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Cliff Macklin Technology Director, Digital & Electrical Systems GE Research |